Global Processors
MediaTek
Dimensity 7400 Ultra
8 • 8 • 2.6 GHz • BGA (SoC)
8Core
8Thread
2.6 GHzBoost
BGA (SoC)Socket
8 • 8 • 2.6 GHz • BGA (SoC)
A summary of MediaTek's official product description.
The Dimensity 7400 platform was introduced in February 2025 as a 4nm mainstream part with four Cortex-A78 cores at 2.6 GHz, four Cortex-A55 cores at 2.0 GHz and Mali-G615 MC2 graphics. MediaTek does not document the Ultra suffix separately: it is the branding phone makers apply to their implementation of the platform.
Manufacturer's official core and architecture information.
8-core — Total Cores · 8 Thread — Concurrent Threads · 4 Performance — High-performance core · 4 Efficiency — Low-power core · Arm Cortex-A78 / A55 — Core architecture
Manufacturer's official frequency values.
2.6 GHz — Maximum boost frequency · 2.0 GHz — Efficiency core frequency
Official power values that determine cooling needs.
Device dependent — Cooling solution
A usage guide built from the specs and the editors' tags; not a test result.
For battery-first buyers; capacity and charging power stand out in the maker's figures.
Good fitA balanced spec set for everyday use: display, battery and camera figures together.
Good fitAn editor's tag for hardware that is well priced for what it offers. We do not track current prices; check the price before you buy.
Good fitThe Kacbu editors' assessment of the specifications the maker publishes. We do not test devices ourselves, so nothing here is a measured result. Anything taken from an independent review is shown with its publication and date in the Press section.
Instead of tracking today's retail price, Kacbu keeps the product's official launch information as a reference.
MediaTek is headquartered in Hsinchu, Taiwan and designs the chip there; it does not run its own fabs — Dimensity chips are produced by TSMC, also in Taiwan.
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What the numbers on the spec sheet actually mean in day-to-day use.
Other products in the same category.
Models built on the same part. The difference is not the part — it is the device around it.
Models built on the same part. The difference is not the part — it is the device around it.